Samsung tests Galaxy S27 Ultra chip as Qualcomm faces overheating issue

Samsung Electronics is conducting final performance checks on Qualcomm’s next-generation application processor planned for the Galaxy S27 Ultra, according to a Sept. 16 report by Seoul Economic Daily cited by ChainCatcher. The issue under review is overheating that leads to lower performance under sustained heavy workloads. People familiar with the matter said the chip repeatedly exceeded Samsung’s internal temperature threshold during recent testing, causing processing speeds to drop. Samsung’s MX business under the DX division has reportedly asked Qualcomm to address the thermal issue by mid-month. Samsung had already shared the test findings with Qualcomm last month, but the chip had still not met Samsung’s thermal stability requirement at the time of the report. The two sides are now working on performance fixes and another round of verification. Samsung plans to finalize the AP choice for the Galaxy S27 series, which is scheduled for mass production at the end of this year, after reviewing the thermal improvement results. If Qualcomm’s Snapdragon solution meets the target, Samsung will stay with the original plan. If not, the company may turn to the Exynos 2700, a chip designed by Samsung System LSI and built on the foundry division’s second-generation 2 nm SF2P process.